➀ Broadcom's deal with ByteDance for a custom AI accelerator chip has been canceled.

➁ The cancellation is due to tightened US semiconductor restrictions on China.

➂ Broadcom could face losses of $2B to $3B from the TikTok ban.

➀ Apple has introduced its first in-house developed 5G modem, the C1, six years after acquiring Intel's 5G modem business unit.

➁ The C1 is designed for the iPhone 16e, a mainstream smartphone, and promises high power efficiency and fast connectivity.

➂ Apple has not disclosed how the C1 achieves its power efficiency, but it is likely due to custom cores and TSMC's 4nm-class process technology.

➀ TSMC's HBM4 memory launch brings significant changes, with the most noticeable being the expansion of memory interfaces from 1024 to 2048 bits;

➁ TSMC revealed details about base die for HBM4 manufacturing using improved versions of its N12 and N5 processes at the 2024 European Technology Symposium;

➂ TSMC plans to adopt two different manufacturing processes, N12FFC+ and N5, for the first batch of HBM4 product packaging;

➃ TSMC is working with major HBM memory suppliers like Micron, Samsung, and SK Hynix to integrate HBM4 memory technology using advanced process nodes;

➄ TSMC's N12FFC+ process is suitable for achieving HBM4 performance, allowing memory manufacturers to build 12-Hi (48GB) and 16-Hi (64GB) stacks with over 2TB/s bandwidth;

➅ TSMC's N5 process will integrate more logic functions, reduce power consumption, and provide higher performance with very small interconnect spacing, enabling HBM4 direct 3D stacking on logic chips.